By using this invention submission form/website, you (the “user” or “you”) agree to be bound by the following terms and conditions (the "Agreement"). Before you may submit any invention information, you must read and accept all the terms and conditions in this Agreement. This Agreement is effective upon acceptance for new users and terms and conditions may be updated from time to time without notice to user.
You hereby acknowledge that:
You are the owner of the invention information and are authorized to submit to company.
Your disclosure is being made on a NON CONFIDENTIAL basis, no confidentiality obligations or legal relationships whatsoever are created by this invention submission, and company is not making any guarantee of secrecy.
You are free to make this submission and, by doing so, you are not infringing any prior obligation of confidentiality.
Company may contact you for additional information and/or samples/prototypes if applicable.
Company may already be independently working on a similar technology as covered by your submission and, therefore, you will not assert any intellectual property rights against company in this respect.
Company may maintain in its files all materials that you submit so as to establish a record thereof.
All of your rights and remedies arising out of your disclosure to company shall be limited to such valid rights as may now or in the future be accorded to you under applicable law or by a written agreement hereafter entered into between you and company.